Organic light emitting display device and method for manufacturing the same

ABSTRACT

An OLED device is disclosed. The OLED device includes: a substrate defined into an active area in which a plurality of pixels are formed in a matrix shape, a GIP (gate-in-panel) area in which drive elements are formed, a ground contact area, and a seal line area; a thin film transistor formed in each pixel region within the active area; an organic light emission diode formed on a protective film and configured to include a first electrode, an organic light emission layer and a second electrode; a bank layer formed to divide the organic light emission diode into pixel units; a signal wiring formed in the ground contact area and the seal line area; and an extended portion formed from the same material as the first electrode of the organic light emission diode and configured to cover the signal wiring, wherein a seal line within in the seal line area is formed on an edge of the signal wiring, which is covered with the extended portion, and an interlayer insulation film adjacent to the edge of the signal wiring. Such an OLED device can prevent a stained fault generation in the seal line region by largely forming a connection electrode, which makes contact with signal wirings formed along edges of an active area, and covering the signal wirings with a metal pattern.

The present patent document is a divisional of U.S. patent applicationSer. No. 13/339,925, filed on Dec. 29, 2011, which claims the priorityand the benefit under 35 U.S.C. §119(a) on Korean Patent Application No.10-2011-0087327 filed on Aug. 30, 2011, the entire contents of which arehereby incorporated by reference.

BACKGROUND

1. Field of the Invention

This disclosure relates to an organic light emitting display (OLED)device and a method of manufacturing the same.

2. Discussion of the Related Art

Image display devices used for displaying a variety of information on ascreen are one of the core technologies of the information andcommunication era. Such image display devices have been being developedto be thinner, lighter, and more portable, and furthermore to have ahigh performance. Actually, flat panel display devices are spotlightedin the display field due to their reduced weight and volume, well knowndisadvantages of cathode ray tubes (CRTs). The flat panel displaydevices include OLED devices, which display images by controlling thelight emitting quantity of an organic light emission layer.

The OLED devices are self-illuminating display devices employing a thinlight emission layer between electrodes. As such, the OLED devices canbecome thinner like a paper. Such OLED devices display images byemitting light through an encapsulated substrate. The encapsulatedsubstrate includes a plurality of pixels arranged in a matrix shape andeach configured with 3 colored (i.e., red, green and blue) sub-pixels, acell driver array, and an organic light emission array.

In order to realize a variety of colors, the OLED device employs organiclight emission layers, which are configured to emit red, green and bluelights, respectively. The organic light emission layer is interposedbetween two electrodes and used to form an organic light emission diode.

FIG. 1 is a cross-sectional view showing a seal region of the OLEDdevice according to the related art.

As shown in FIG. 1, the OLED device is defined into an active area onwhich a plurality of pixels each including an organic light emissiondiode are arranged, and a pad area in which drive elements or powersupply wirings are formed along the outline of the active area. A sealline area occupying edges of the pad area is included. In the seal linearea, a sealant used for combining an array substrate provided with theorganic light emission diodes with an upper substrate 18 is disposed.

The array substrate of the OLED device includes a buffer layer 11, agate insulation layer 12 and an interlayer insulation film 13 stacked ona lower substrate 10. The array substrate further includes signalwirings 15 formed on the interlayer insulation film 13. The signalwirings 15 may be used for forming either the power supply wirings witha ground wiring or the drive elements. A reference number “20”, which isinserted in the drawing but not explained, indicates a bank layer. Thebank layer 20 is used for not only defining the pixel regions within theactive area but also forming the organic light emission diodes.

When the elements such as thin film transistors and the organic lightemission diodes are formed on the lower substrate 10 as described above,a seal line 19 is formed along edges of the lower substrate in such amanner as to be across the signal wirings 15 (or the power wirings).Then, the upper and lower substrates 20 and 10 are combined with eachother.

As shown in the drawing, a protective film, which had been formed on thesignal wiring 15 is removed in order to reduce a number of processes. Inother words, the protective film formation process is removed from therecent manufacturing process of an OLED device. However, due to this, astained fault is generated in an area in which the seal line 19 and thesignal wiring 15 are disposed.

FIG. 2 is a photographic view showing a stained fault, which isgenerated in the seal line area of the OLED device according to therelated art. Referring to FIG. 2, it is seen that a stained fault isgenerated in an area A, which includes the seal line 19 formed on thesignal wiring 15.

In other words, the stained fault which had been not generated in thecase that the related art protective film is formed on the thin filmtransistor region of the active area and the signal wiring region of thepad area, is caused by removing the protective film formation process.

However, it is necessary to reduce a number of manufacturing processesby removing the protective film formation process, in order to providehigh productivity and the cost reduction for the OLED device. Therefore,a new technology adapted to reduce a number of processes and prevent thestained fault must be developed.

BRIEF SUMMARY

According to one general aspect of the present embodiment, an OLEDdevice includes: a substrate defined into an active area in which aplurality of pixels are formed in a matrix shape, a GIP (gate-in-panel)area in which drive elements are formed, a ground contact area, and aseal line area; a thin film transistor formed in each pixel regionwithin the active area; an organic light emission diode formed on aprotective film and configured to include a first electrode, an organiclight emission layer and a second electrode; a bank layer formed todivide the organic light emission diode into pixel units; a signalwiring formed in the ground contact area and the seal line area; and anextended portion formed from the same material as the first electrode ofthe organic light emission diode and configured to cover the signalwiring, wherein a seal line within in the seal line area is formed on anedge of the signal wiring, which is covered with the extended portion,and an interlayer insulation film adjacent to the edge of the signalwiring.

An OLED device manufacturing method according to another general aspectof the present embodiment includes: preparing a substrate defined intoan active area in which a plurality of pixels will be formed in a matrixshape, a GIP (gate-in-panel) area in which drive elements will beformed, a ground contact area, and a seal line area; forming a thin filmtransistor, which is configured with a channel layer, a gate insulationfilm, a gate electrode, and source and drain electrodes, in each pixelregion within the active area as well as a signal wiring on aninterlayer insulation film corresponding to the seal line area and theground contact area; forming a protective film on the substrate providedwith the thin film transistor, and exposing a part of the drainelectrode of the thin film transistor and the signal wiring through acontact hole formation process; and forming an organic light emissiondiode, which is configured with a first electrode, an organic lightemission layer and a second electrode, on the substrate provided withthe protective film, wherein an extended portion is formed to cover thesignal wiring at the formation of the first electrode.

An OLED device according to still another general aspect of the presentembodiment includes: a substrate defined into an active area in which aplurality of pixels will be formed in a matrix shape, a GIP(gate-in-panel) area in which drive elements will be formed, a groundcontact area, and a seal line area; a thin film transistor formed ineach pixel region within the active area; an organic light emissiondiode configured to include a first electrode, an organic light emissionlayer and a second electrode and formed on a protective film which isprovided to cover the thin film transistor; a bank layer formed todivide the organic light emission diode into pixel units; a signalwiring formed in the ground contact area and the seal line area; and aseal line formed in the seal line area, wherein the signal wiring isformed in the same layer as a gate electrode of the thin film transistorbetween a gate insulation film and an interlayer insulation film, andthe seal line opposite to the signal wiring is formed on the interlayerinsulation film which is formed to cover the signal wiring.

An OLED device manufacturing method according to further still anothergeneral aspect of the present embodiment includes: preparing a substratedefined into an active area in which a plurality of pixels will beformed in a matrix shape, a GIP (gate-in-panel) area in which driveelements will be formed, a ground contact area, and a seal line area;forming a thin film transistor, which is configured with a channellayer, a gate electrode, and source and drain electrodes, in each pixelregion within the active area as well as a signal wiring on a gateinsulation film corresponding to the seal line area and the groundcontact area at the formation of the gate electrode; forming aprotective film on the substrate provided with the thin film transistor,and exposing a part of the drain electrode of the thin film transistor;forming an organic light emission diode, which is configured with afirst electrode, an organic light emission layer and a second electrode,on the substrate provided with the protective film; and forming a sealline on an interlayer insulation film, which is formed to cover thesignal wiring, within the seal line area and in direct contact with theinterlayer insulation film.

Other systems, methods, features and advantages will be, or will become,apparent to one with skill in the art upon examination of the followingfigures and detailed description. It is intended that all suchadditional systems, methods, features and advantages be included withinthis description, be within the scope of the invention, and be protectedby the following claims. Nothing in this section should be taken as alimitation on those claims. Further aspects and advantages are discussedbelow in conjunction with the embodiments. It is to be understood thatboth the foregoing general description and the following detaileddescription of the present disclosure are exemplary and explanatory andare intended to provide further explanation of the disclosure asclaimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the embodiments and are incorporated in and constitutea part of this application, illustrate embodiment(s) of the inventionand together with the description serve to explain the disclosure. Inthe drawings:

FIG. 1 is a cross-sectional view showing a seal region of the OLEDdevice according to the related art;

FIG. 2 is a photographic view showing a stained fault which is generatedin a seal line area of the OLED device according to the related art;

FIG. 3 is a planar view showing the structure of an OLED deviceaccording to an embodiment of the present disclosure;

FIG. 4 is a cross-sectional view showing the OLED device taken along aline I-I′ in FIG. 3;

FIGS. 5A to 5D are cross-sectional views illustrating a method ofmanufacturing an OLED device according to an embodiment of the presentdisclosure; and

FIGS. 6 and 7 are cross-sectional views showing OLED devices accordingto other embodiments of the present disclosure.

DETAILED DESCRIPTION OF THE DRAWINGS AND THE PRESENTLY PREFERREDEMBODIMENTS

Reference will now be made in detail to the embodiments of the presentdisclosure, examples of which are illustrated in the accompanyingdrawings. These embodiments introduced hereinafter are provided asexamples in order to convey their spirits to the ordinary skilled personin the art. Therefore, these embodiments might be embodied in adifferent shape, so are not limited to these embodiments described here.In the drawings, the size, thickness and so on of a device can beexaggerated for convenience of explanation. Wherever possible, the samereference numbers will be used throughout this disclosure including thedrawings to refer to the same or like parts.

FIG. 3 is a planar view showing the structure of an OLED deviceaccording to an embodiment of the present disclosure. FIG. 4 is across-sectional view showing the OLED device taken along a line I-I′ inFIG. 3.

Referring to FIGS. 3 and 4, the OLED device 100 can be defined into anactive area (an X area), a seal line area (a Z area) and a GIP(Gate-In-Panel) area (a Y area). The active area (X area) can be definedinto a plurality of pixel regions arranged in a matrix shape. An organiclight emission diode 230 and a thin film transistor TFT are formed ineach of the pixel regions. The seal line area (Z area) occupying edgesof the OLED device 100 is used for combining a lower substrate 200 withan upper substrate 300. The GIP area (Y area) is positioned between theactive area (X area) and the seal line area (Z area). Gate drive circuitelements are formed in the GIP area (Y area).

A pad area 130 and a data driver area 140 can be provided in an edge ofthe OLED device 100. The pad area 130 is used for electrical connectionswith external signal connectors (not shown).

As shown in the drawings, a ground contact area positioned between theGIP area (Y area) and the seal line area (Z area) can be furtherincluded in the OLED device 100. Signal wirings 275 for groundconnections are formed on the ground contact area. The signal wirings275 are in electrical contact with the elements within the GIP area (Yarea).

In the detailed structure of the OLED device according to an embodimentof the present disclosure, the thin film transistor TFT is formed in theactive area (X area) of the lower substrate 200. The thin filmtransistor TFT is configured with a channel layer 214 formed on a bufferlayer 201 which is formed on the lower substrate 200, a gate electrode211 formed on a gate insulation film 202 which is formed to cover thechannel layer 214, and source and drain electrodes 217 a and 217 bconfigured to contact source and drain regions of the channel layer 214through contact holes which are formed with having the gate electrode211 therebetween.

Also, the organic light emission diode 230 is formed over the thin filmtransistor TFT. The organic light emission diode 230 is configured witha first electrode (an anode) 220, an organic light emission layer 221and a second electrode (a cathode) 223 sequentially formed opposite thethin film transistor TFT with having a protective film 209 therebetween.The protective film 209 is formed from an organic material.

The organic light emission diode 230 is divided into pixel units by abank layer 240. The bank layer 240 is used for defining the plurality ofpixel regions.

In order to reduce a number of mask processes, an embodiment of thepresent disclosure forces the bank layer 240 and a spacer 250 to beformed in a single body using a single mask such as a half-tone mask ora diffractive mask.

Similarly to the active area (X area), the buffer layer 201 and the gateinsulation film 202 are also formed on the lower substrate 200corresponding to the GIP area (Y area), the ground contact area and theseal line area (Z area). Moreover, a plurality of drive elements (notshown) and a power supply wiring 247 is formed on the gate insulationfilm 202 corresponding to the GIP area (Y area).

Also, the protective film 209 is formed on the lower substrate where theplurality of drive elements are formed. A first connection electrode 270positioned at the same layer as the first electrode 220 and a secondconnection electrode 260 extended from the second electrode 223 aresequentially formed on the protective film 209. The first and secondconnection electrodes 270 and 260 are used for grounding the secondelectrode 223 of the organic light emission diode 230 within the activearea (X area).

The first and second connection electrodes 270 and 260 are in electricalcontact with each other through a contact hole, which is formed in thebank layer 240. An extended portion 270 a is formed to extend from thefirst connection electrode 270 to the seal line area (Z area) andelectrically contact a signal wiring 275. The signal wiring 275 canbecome a ground wiring. The extended portion 270 a configured to extendfrom the first electrode 270 completely covers the signal wiring 275which is formed on the interlayer insulation film 212 corresponding tothe ground contact area and the seal line area (Z area).

A seal line 400 is formed on the signal wiring 275 covered with theextended portion 270 a.

In this manner, the OLED device according to an embodiment of thepresent disclosure enables the signal wiring 275 formed in the seal linearea (Z area) and the ground contact area to be covered with theextended portion 270 a, which is formed to extend from the firstconnection electrode 270 at the formation of the first electrode 220 ofthe organic light emission diode 230, instead of the protective film. Assuch, the seal line 400 directly contacts the extended portion 270 a. Inother words, the seal line 400 contacts the extended portion 270 a witha superior adhesive property. In accordance therewith, the combiningcharacteristic of the lower and upper substrates 200 and 300 can beenhanced.

Also, the OLED device according to an embodiment of the presentdisclosure forces the signal wiring 275 to be positioned in an innerdirection from the center of the seal line 400 toward the center of thelower substrate 200. As such, the seal line 400 contacts the interlayerinsulation film 212, adjacent to the signal wiring 275, and the extendedportion 270 a covering the signal wiring 275. In accordance therewith,the deterioration fault of the organic light emission diode 230 due tothe intrusion of moisture can be prevented.

FIGS. 5A to 5D are cross-sectional views illustrating a method ofmanufacturing an OLED device according to an embodiment of the presentdisclosure.

Referring to FIGS. 5A through 5D, a buffer layer 201 is formed on alower substrate 200 which is defined into an active area (X area), a GIParea (Y area), a ground contact area, and a seal line area (Z area).

As an example of the lower substrate 200, an insulated glass, plastic,or conductive substrate can be used. The buffer layer 201 can be formedfrom either an organic insulation material such as polyimide,photoacrylic and so on, or an inorganic insulation material such asSiN_(x) and SiO₂.

A thin film transistor TFT of the top-gate type is formed in the activearea (X area). In order to form the thin film transistor TFT, a channellayer 214 is formed on the buffer layer 201. The channel layer 214includes a channel region and source/drain regions doped withimpurities. An gate insulation film 202 is formed on the entire surfaceof the lower substrate 200 provided with the channel layer 214.

The channel layer 214 can be prepared by forming an amorphous siliconlayer on the buffer layer 201 and crystallizing the amorphous siliconinto a crystalline silicon layer through a heat treatment process. Thegate insulation film 202 can be formed from an inorganic insulationmaterial such as silicon nitride SiN_(x), silicon oxide SiO_(x) and soon. Also, the gate insulation film 202 can include either a single layerformed from one of the inorganic insulation materials, or multiplelayers formed from different inorganic insulation materials.

After the above-mentioned gate insulation film 202 is formed on thelower substrate 200, a gate electrode 211 is formed on the gateinsulation film 202 opposite to the channel layer 214. The gateelectrode 211 can be prepared by forming a metal film on the entire areaof the lower substrate 200 and patterning the metal film through a maskprocess.

At the same time, a power supply wiring 247 and other gate electrodes oftransistors included in a plurality of drive elements, which are notshown in the drawings, are formed on the GIP area (Y area) of the lowersubstrate 200 (more specifically, on the gate insulation film 202corresponding to the GIP area (Y area)).

Meanwhile, the buffer layer 201 and the gate insulation film 202 arestacked on the lower substrate 200 corresponding to the seal line area(Z area) and the ground contact area.

As shown in FIG. 5C, an interlayer insulation film 212 is formed on theentire surface of the lower substrate 200 and contact holes are formedin the interlayer insulation film 212 opposite to the source/drainregions of the channel layer 214 through a contact hole formationprocess, after the formation of the above-mentioned gate electrode 211and so on.

Thereafter, the thin film transistor is completed by formingsource/drain electrodes 217 a and 217 b which are being in electricalcontact with the source/drain regions of the channel layer 214,respectively. The source/drain electrodes 217 a and 217 b are formed bydepositing a source/drain metal film on the entire surface of the lowersubstrate 200 and patterning the source/drain metal film through anothermask process.

The source/drain metal film can be formed in either a single layer or astructure of multiple layers, formed from copper Cu, aluminum Al,aluminum alloy AlNd, molybdenum Mo, chrome Cr, titanium Ti, tatalium Ta,molybdenum-tungsten MoW, alloys thereof, and so on.

At the same time, signal wirings 275 are formed on the interlayerinsulation film 212 corresponding to the seal line area (Z area) and theground contact area. Data lines and source/drain electrodes oftransistors, which are not shown in the drawings, are also formed in theinterlayer insulation film 212 corresponding to the GIP area (Y area).

After the above-mentioned thin film transistor TFT is completed, aprotective film 209 is formed on the entire surface of the lowersubstrate 200. Still another mask process is performed for theprotective film 209 so that a contact hole is formed in the protectivefilm 209 opposite to the drain electrode 217 b and the signal wiringsformed in the seal line area (Z area) and the ground contact area areexternally exposed.

The protective film 209 can be formed from either an inorganicinsulation material or an organic insulation material such as BCB(benzocyclobutene), an acrylic-based resin, PFCB, or others. Also, theprotective film 209 can be formed by applying one of the above-mentionedmaterials through a spin coating method and so on.

Afterward, a first electrode 220 for an organic light emission diode 230is formed on the protective film 209 in such a manner as to electricallycontact the drain electrode 217 b of the thin film transistor TFT. Thefirst electrode 220 of the organic light emission diode 230 is preparedby forming a metal film on the entire surface of the above-mentionedlower substrate 200 and patterning the metal film through further stillanother mask process.

The first electrode 220 can be formed from a transparent conductivematerial such as ITO (indium tin oxide), TO (tin oxide), IZO (indiumzinc oxide), ITZO (indium tin zinc oxide), or others. Alternatively, thefirst electrode 220 can be formed with a structure of double or triplelayers including a metal film such a silver film.

When the first electrode 220 is formed, a first connection electrode 270and an extended portion 270 a configured to extend from the firstelectrode to the seal line area (Z area) are simultaneously formed inthe GIP area (Y area), the ground contact area and the seal line area (Zarea). The first connection electrode 270 and the extended portion 270 aare formed in a single body united with each other and from the samematerial.

According to the manufacturing method of the present embodiment, theextended portion 270 a is formed to completely cover the signal wirings275 which is externally exposed by removing the protective film 209. Assuch, the signal wirings 275 can be screened from the exterior by theextended portion 270 a.

After the above-mentioned first electrode 220 is formed, a bank layer240 for defining a formation area of the organic light emission diode230 into pixel units and a spacer 250 are formed in a single bode unitedwith each other. The bank layer 240 and the spacer 250 can be preparedby forming an organic film on the entire surface of the above-mentionedlower substrate 200 and patterning the organic film using either ahalf-tone mask or a diffractive mask.

More specifically, the organic film is formed to have a thicknesscorresponding to the height of the spacer 250. Also, the organic film ispatterned by allowing a semi-transmission region of the half-tone maskor a diffractive pattern of the diffractive mask to be opposite the banklayer 240, a non-transmission region of the half-tone mask ordiffractive mask to be opposite the spacer 250, and a transmissionregion of the half-tone mask or the diffractive mask to be opposite aregion of the first electrode 220 which will be exposed.

Thereafter, an organic light emission layer 221 and a second electrode223 are sequentially formed on the exposed portion of the firstelectrode 220. In accordance therewith, the organic light emission diode230 is completed.

In other words, the bank layer 240 defines the active area (X area) ofthe OLED device 100 into pixel units. Red, green, blue, or white organiclight emission layer 221 can be formed in each of the pixel regions.

A reference number “260”, which is inserted in the drawings but notexplained, indicates a second connection electrode. The secondconnection electrode 260 is formed in a single body united with thesecond electrode 223. Also, the second connection electrode 260 comes inelectrical contact with the first connection electrode 270, which isformed under the bank layer in the GIP area (Y area).

After the above-mentioned organic light emission diode 230 is formed onthe lower substrate 200, a seal line 400 is formed on the lowersubstrate 200 corresponding to the seal line area (Z area), and then anupper substrate 300 is combined with the lower substrate 200. Inaccordance therewith, the OLED device is completed.

Particularly, the OLED device manufacturing method of the presentembodiment forces the seal line 400 to be formed on edges of the signalwiring 275 and the extended portion 270 a as well as the interlayerinsulation film 212 adjacent to the signal wiring 275. As such, thesignal wiring 275 is not exposed to the exterior unlike that of therelated art.

Moreover, the seal line 400 directly contacts the extended portion 270 acovering the signal line 275 without being in direct contact with thesignal wiring 275. As such, the contacting property of the seal line 400can be enhanced compared to when it is in contact with the signal wiring275.

In this way, the OLED device manufacturing method of the presentembodiment forces the signal wirings formed along outlines of the activearea to be covered with the extended portion, which is formed from ametal material. As such, the OLED device can prevent external moistureintrusion.

Also, the OLED device manufacturing method of the present embodimentforces edges of the signal wiring 275 and the extended portion 270 a tobe positioned in an inner direction of the OLED device 100 tending fromthe center of the seal line 400 within the seal line area (Z area)toward the active area (X area). In accordance therewith, adeterioration phenomenon of the organic light emission diode 230, whichcan be caused by moisture intrusion, can be prevented.

FIGS. 6 and 7 are cross-sectional views showing OLED devices accordingto other embodiments of the present disclosure. Reference numbers ofFIGS. 6 and 7 being the same as those of FIG. 4 correspond to the samecomponents. Therefore, the OLED devices of FIGS. 6 and 7 will beexplained in regards to the components, which are distinguished fromthose of FIG. 4.

Referring to FIG. 6, the OLED device according to another embodiment ofthe present disclosure can be defined into an active area (X area), aseal line area (Z area), a GIP area (Y area) and a ground contact area.The active area (X area) can be defined into a plurality of pixelregions arranged in a matrix shape. An organic light emission diode 230and a thin film transistor TFT are formed in each of the pixel regions.The seal line area (Z area) occupying edges of the OLED device 100 isused for combining a lower substrate 200 with an upper substrate 300.The GIP area (Y area) is positioned between the active area (X area) andthe seal line area (Z area). Gate drive circuit elements are formed inthe GIP area (Y area).

According to another embodiment of the present disclosure, a bufferlayer 201, a channel layer 214 and a gate insulation film 202 aresequentially formed on the lower substrate 200, and then a gateelectrode 211 is formed on the gate insulation film 202 opposite to thechannel layer 214. The gate electrode 211 can be prepared by forming ametal film on the entire surface of the lower substrate 200 with thegate insulation film 202 and patterning the metal film through a maskprocess.

At the formation of the gate electrode 211, a power supply wiring 247 inthe GIP area (Y area) and signal wirings 375 in the seal line area (Zarea) and the ground contact area are simultaneously formed.

After the formation of the above-mentioned gate electrode 211 and signalwirings 375, an interlayer insulation film 212 is formed on the entiresurface of the lower substrate 200.

When, the above-mentioned interlayer insulation film 212 is formed onthe lower substrate 200, contact holes are formed in regions of theinterlayer insulation film opposite to source/drain regions of thechannel layer 214 through a contact hole formation process. At the sametime, still another contact hole can be formed in still another regionof the interlayer insulation film 212 opposite to the signal wirings375. Although it is not shown in the drawing, still another contact holewill be used for bringing a first connection electrode 370 intoelectrical contact with one of the signal wirings 375 later.

Subsequently, source/drain electrodes 217 a and 217 b being inelectrical contact with the source/drain regions of the channel layer214 are formed, so that a thin film transistor is completed. Thesource/drain electrodes 217 a and 217 b can be prepared by forming asource/drain metal film on the entire surface of the lower substrate 200with the contact holes and patterning the source/drain metal filmthrough another mask process.

The source/drain metal film can be formed in a single layer or amulti-layer structure. The single layer and the multi-layers can beformed from copper Cu, aluminum Al, aluminum alloy AlNd, molybdenum Mo,chrome Cr, titanium Ti, tatalium Ta, molybdenum-tungsten MoW, alloysthereof, and so on.

After the above-mentioned thin film transistor is completed, aprotective film 209 is formed on the entire surface of the lowersubstrate 200. Still another mask process is performed for theprotective film 209 so that a contact hole is formed in the protectivefilm 209 opposite to the drain electrode 217 b. Also, another contacthole exposing one of the signal wirings 375 which are formed in the sealline area (Z area) and the ground contact area can be formed throughstill another mask process.

In other words, the contact hole used for electrically connecting thesignal wiring 375 with the first connection electrode 370 is formed whenforming another contact hole in the protective film 209, not whenforming still another contact holes in the interlayer insulation film212. When another contact hole is formed in the protective film 209, thecontact hole for connecting the signal wiring 375 with the firstconnection electrode 370 can be formed by sequentially removing regionsof the protective film 209 and the interlayer insulation film 212 whichare opposite the signal wiring 375.

More specifically, the protective film 209 within the seal line area (Zarea) and the ground contact area is removed to expose the interlayerinsulation film 212 when another contact hole is formed in theprotective film 202. Then, the above-mentioned contact hole exposing apart of the signal wirings 375 can be formed in the interlayerinsulation film 212.

The protective film 209 can be formed from either an inorganicinsulation material or an organic insulation material such as BCB(benzocyclobutene), an acrylic-based resin, PFCB, or others. Also, theprotective film 209 can be formed by applying one of the above-mentionedmaterials through a spin coating method and so on.

Afterward, a first electrode 220 for an organic light emission diode 230is formed on the protective film 209 in such a manner as to electricallycontact the drain electrode 217 b of the thin film transistor TFT. Thefirst electrode 220 of the organic light emission diode 230 is preparedby forming a metal film on the entire surface of the above-mentionedlower substrate 200 and patterning the metal film through further stillanother mask process.

The first electrode 220 can be formed from a transparent conductivematerial such as ITO (indium tin oxide), TO (tin oxide), IZO (indiumzinc oxide), ITZO (indium tin zinc oxide), or others. Alternatively, thefirst electrode 220 can be formed with a structure of double or triplelayers including a metal film such a silver film.

When the first electrode 220 is formed, the first connection electrode370 can be simultaneously formed in the GIP area (Y area), the groundcontact area and the seal line area (Z area). The first connectionelectrode 370 is formed from the same material. Such a first connectionelectrode 370 is formed on the protective film 209 and comes inelectrical contact with a second connection electrode 260 which will beformed later.

Thereafter, an organic light emission diode 230, the second connectionelectrode 260 and a seal line 400 are formed through the same processesas those described in FIG. 4. As such, the detailed descriptionregarding the formation of the organic light emission diode 230, thesecond connection electrode 260 and the seal line 400 will be omitted toavoid overlapping.

In this manner, another embodiment of the present disclosure forces thesignal wirings 375 overlapped with the seal line 400 to be not onlyformed on the gate insulation film 202 but also completely covered withthe interlayer insulation film 212 which is formed later. As such, theseal line 400 comes into direct contact with the upper substrate 300 andthe interlayer insulation film 212 of the lower substrate 200.Therefore, the adhesive property of the seal line 400 for the interlayerinsulation film 212 can be largely enhanced compared to that for themetal pattern.

Also, another embodiment of the present disclosure makes the signalwirings disposed under the seal line to be formed between the gateinsulation film and the interlayer insulation film. In accordancetherewith, a deterioration phenomenon of the organic light emissiondiode, which can be caused by moisture intrusion can be prevented.

Furthermore, another embodiment of the present disclosure allows thesignal wirings to be formed under an insulation film (more specifically,under the interlayer insulation film) so that the signal wirings are notexposed to the outside of the seal line area. Therefore, moistureintrusion into the signal wiring area in which the seal line is formedcan be prevented.

As shown in FIGS. 3 and 4, the signal wirings 275 can be formed in theseal line area (Z area) and the ground contact area in such a manner asto be positioned in a inner direction from the seal line 400 toward anactive area (X area). In this case, the resistance of the signal wiring275 must increase because of its narrowed width.

To address this matter, still another embodiment of the presentdisclosure forces an auxiliary signal wiring 475 to be formed on thegate insulation film 202 at the formation of the gate electrode, asshown in FIG. 7. Subsequently, a through hole H is formed in theinterlayer insulation film 212 opposite to the auxiliary signal wiring475 when the contact holes for the source/drain electrodes 217 a and 217b are formed in the interlayer insulation film 212. Thereafter, theauxiliary signal wiring 475 comes into electrical contact with a signalwiring 275 via the through hole H when the signal wiring 275 is formedon the interlayer insulation film 212. In accordance therewith, theresistance increment of the signal wiring 275 can be prevented oralleviated.

Also, still another embodiment of the present disclosure covers thesignal wiring 275 within the seal line area (Z area) and the groundcontact area with an extended portion 270 a, which is formed to extendfrom the a first electrode at the formation of the signal wiring 275,instead of the protective film 209. As such, a seal line 400 comes intodirect contact with the extended portion 270 a. In other words, the sealline 400 contacts the extended portion 270 a with a superior adhesiveproperty. In accordance therewith, the combining characteristic of thelower and upper substrates 200 and 300 can be enhanced.

Moreover, the OLED device according to an embodiment of the presentdisclosure forces the signal wiring 275 to be positioned in an innerdirection from the center of the seal line 400 toward the center of thelower substrate 200. As such, the seal line 400 contacts the interlayerinsulation film 212, adjacent to the signal wiring 275, and the extendedportion 270 a covering the signal wiring 275. In accordance therewith,the deterioration fault of the organic light emission diode 230 due tothe intrusion of moisture can be prevented.

Particularly, still another embodiment of the present disclosure cansolve the resistance increment of the signal wiring 275 caused by thenarrowed width. To this end, the auxiliary signal wiring 475 is formedon the gate insulation film 202 opposite to the signal wiring 275 insuch a manner as to be electrically connected to the signal wiring 275.

Although the present disclosure has been limitedly explained regardingonly the embodiments described above, it should be understood by theordinary skilled person in the art that the present disclosure is notlimited to these embodiments, but rather that various changes ormodifications thereof are possible without departing from the spirit ofthe present disclosure. Accordingly, the scope of the present disclosureshall be determined only by the appended claims and their equivalents.

The invention claimed is:
 1. A method of manufacturing an organic lightemitting display device, the method comprising: preparing a substratedefined into an active area in which a plurality of pixels will beformed in a matrix shape, a GIP (gate-in-panel) area in which driveelements will be formed, a ground contact area, and a seal line area;forming a thin film transistor, which is configured with a channellayer, a gate insulation film, a gate electrode, and source and drainelectrodes, in each pixel region within the active area as well as asignal wiring on an interlayer insulation film corresponding to the sealline area and the ground contact area; forming a protective film on thesubstrate provided with the thin film transistor, and exposing a part ofthe drain electrode of the thin film transistor and the signal wiringthrough a contact hole formation process; forming an extend portion onthe signal wiring; and forming an organic light emission diode, which isconfigured with a first electrode, an organic light emission layer and asecond electrode, on the protective film, wherein the extended portionis formed on the signal wiring simultaneously with formation of thefirst electrode.
 2. The method claimed as claim 1, wherein the formationof the organic light emission diode further includes: forming a materiallayer on the protective film, the material layer including a firstportion defining a bank layer and a second portion defining a spacer,wherein the bank layer is configured to divide the active area intopixel regions, and the second portion extends upwardly from the firstportion, the first and second portions being a single body.
 3. Themethod claimed as claim 1, further comprises forming a seal lineconfigured to directly contact an edge of the signal wiring and theinterlayer insulation film adjacent to the edge of the signal wiring. 4.The method claimed as claim 1, wherein a first connection electrode isformed on the protective film and electrically connected to a secondconnection electrode, wherein the second connection electrode issimultaneously with formation of the second electrode of the organiclight emission diode, the second connection electrode and the secondelectrode are formed as a single body.
 5. The method claimed as claim 1,wherein the protective film is formed from one of an inorganicinsulation material and organic insulation materials including BCB(benzocyclobutene), an acryl-based resin and PFCB.
 6. The method claimedas claim 1, further comprising forming an auxiliary signal wiring on thegate insulation film simultaneously with formation of the gateelectrode, the auxiliary signal wiring being disposed opposite to thesignal wiring with the interlayer insulation film disposed therebetween.7. The method claimed as claim 6, wherein the auxiliary signal wiring iselectrically connected to the signal wiring via a through hole formed inthe interlayer insulation film.
 8. A method of manufacturing an organiclight emitting display device, the method comprising: preparing asubstrate defined into an active area in which a plurality of pixelswill be formed in a matrix shape, a GIP (gate-in-panel) area in whichdrive elements will be formed, a ground contact area, and a seal linearea; forming a thin film transistor, which is configured with a channellayer, a gate electrode, and source and drain electrodes, on a gateinsulation film in each pixel region within the active area; forming asignal wiring on the gate insulation film corresponding to the seal linearea and the ground contact area simultaneously with formation of thegate electrode; forming a protective film on the substrate provided withthe thin film transistor, and exposing a part of the drain electrode ofthe thin film transistor; forming an organic light emission diode, whichis configured with a first electrode, an organic light emission layerand a second electrode, on the substrate provided with the protectivefilm; and forming a seal line on an interlayer insulation film, which isformed to cover the signal wiring, within the seal line area and indirect contact with the interlayer insulation film.